A BGA (Ball Grid Array) Rework Station, also known as a BGA rework system or BGA rework machine, is a specialized piece of equipment used in the electronics industry for reworking or repairing BGA components on printed circuit boards (PCBs).

BGA components are a type of surface-mount integrated circuit package that uses an array of solder balls on the underside of the chip for electrical connections. Due to their compact size and high pin density, BGAs can be challenging to repair or replace if they become faulty or damaged.

A BGA rework station is designed to heat, remove, and replace BGA components on a PCB. It typically consists of various components, including a heating system, a temperature control unit, a high-resolution camera or microscope for visual inspection, and a rework station with nozzles or heads for applying heat and soldering.

The process of BGA rework involves heating the PCB to a specific temperature using hot air or infrared heating, which allows the solder beneath the BGA component to melt. The faulty or damaged BGA chip is then carefully removed from the PCB using a specialized tool or vacuum system. Once removed, a new BGA chip can be placed on the PCB, aligned correctly, and soldered into place using the rework station.

BGA rework stations are utilized in electronics manufacturing and repair facilities to address BGA-related issues, such as component failures, manufacturing defects, or upgrading/replacing outdated components. They require skilled operators who are familiar with the rework process and have experience in handling sensitive electronic components.